مواد و فناوری‌های پیشرفته

مواد و فناوری‌های پیشرفته

تأثیر دماها و زمان‌های نگهداری مختلف بر خواص ریزساختار و مکانیکی اتصال دومرحله‌ای TLP سوپرآلیاژ CMSX-4

نوع مقاله : مقاله کامل پژوهشی

نویسندگان
آرش فرجی 1
محمدرضا رحیمی پور 2
محمد فرویزی 3
حمید امیدوار 4
1 دانشجوی دکتری تخصصی، پژوهشکده‌ی سرامیک، پژوهشگاه مواد و انرژی، کرج، ایران
2 استاد، پژوهشکده‌ی سرامیک، پژوهشگاه مواد و انرژی، کرج، ایران
3 دانشیار، دانشکده‌ی مهندسی مواد، دانشگاه تبریز، تبریز، ایران
4 دانشیار، دانشکده‌ی مهندسی معدن و متالورژی، دانشگاه امیرکبیر، تهران، ایران
10.30501/jamt.2025.521355.1328
چکیده
اتصال فاز مایع گذرا (TLP) فرایندی مهم برای اتصال موادی نظیر CMSX-4 به شمار می‌رود که در آن کنترل دقیق متغیرها برای دستیابی به نتایج مطلوب اهمیت بسزایی دارد. این مطالعه به بررسی تأثیر دما و زمان نگهداری در فرایند TLP  دومرحله‌ای بر ریزساختار و رفتار مکانیکی سوپرآلیاژ CMSX-4 می‌پردازد. در این تحقیق، سوپرآلیاژ CMSX-4  با استفاده از فیلر MBF 20 در دماهای 1100 و 1150 درجه‌ی سلسیوس در زمان‌های مختلف به یکدیگر متصل شد. ریزساختار و خواص مکانیکی اتصالات ایجادشده به‌وسیله‌ی پراش پرتو ایکس، میکروسکوپ الکترونی، طیف‌سنجی عنصری، ریزسختی و آزمون‌های برش ارزیابی شد. نتایج نشان داد که انجماد هم‌دمای کامل در نمونه‌های متصل‌شده در دمای 1150 درجه‌ی سلسیوس به‌مدت 85 دقیقه و در دمای 1100 درجه‌ی سلسیوس به‌مدت 120 دقیقه حاصل شد. بررسی‌های ریزساختاری مناطق مختلفی را در اتصالات نشان داد ازجمله ناحیه‌ی انجماد غیرهم‌دما (ASZ)، ناحیه‌ی انجماد هم‌دما (ISZ) و ناحیه‌ی متأثر از نفود (DAZ). استحکام با افزایش زمان و حذف مناطق مضر ASZ افزایش یافت که به رسوب ریزساختارهای منحصربه‌فردی نظیر بوریدهای غنی از نیکل و کروم و فاز محلول جامد γ' در ناحیه‌ی اتصال منجر شد. علاوه‌براین، بالاترین استحکام برشی (تقریباً 670 مگاپاسکال) در نمونه‌ی متصل‌شده در دمای ۱۱۵۰ درجه‌ی سلسیوس به‌مدت 85 دقیقه مشاهده شد. نکته‌ی قابل‌توجه آن است که انجماد ناقص در طول فرایند اتصال بالاترین ریزسختی را در ناحیه‌ی اتصال به وجود آورد که سبب کاهش استحکام برشی شد.
کلیدواژه‌ها
CMSX4
اتصال فاز مایع گذرا
دمای اتصال
ریزساختار
استحکام برشی

موضوعات

عنوان مقاله English

The Effect of Different Temperatures and Holding Times on Microstructural and Mechanical Characterization in the Two-Stage TLP Bonding of CMSX-4 Superalloy

نویسندگان English

Arash Faraji 1
Mohammad Reza Rahimipour 2
Mohammad Farvizi 3
Hamid Omidvar 4
1 PhD Student, Department of Ceramic, Materials and Energy Research Center, Karaj, Iran.
2 Professor, Department of Ceramic, Materials and Energy Research Center, Karaj, Iran.
3 Associate Professor, Department of Materials Engineering, Faculty of Mechanical Engineering, University of Tabriz, P. O. Box: 51666-16471, Tabriz, , Iran.
4 Associate Professor, Department of Mining and Metallurgical Engineering, Amir Kabir University of Technology (Tehran Polytechnic), P. O. Box: 15875-4413,Tehran, Iran.
چکیده English

Transient liquid phase (TLP) bonding is a critical process for joining materials such as CMSX-4, where precise control of variables is essential for achieving optimal results. This study investigates the effect of temperature and holding time in a two-step TLP process on the microstructural and mechanical behavior of CMSX-4 superalloy. In this work, CMSX-4 was joined using MBF 20 filler metal at temperatures of 1100°C and 1150°C for varying durations. The microstructure and mechanical properties of the bonded joints were characterized by X-Ray Diffraction (XRD), electron microscopy, elemental spectroscopy (EDS/WDS), microhardness testing, and shear tests. The results showed that complete isothermal solidification was achieved in the samples bonded at 1150°C for 85 minutes and at 1100°C for 120 minutes. Microstructural examination revealed different zones in the joints, including the Athermal Solidification Zone (ASZ), Isothermal Solidification Zone (ISZ), and Diffusion-Affected Zone (DAZ). The strength increased upon increasing time and eliminating the deleterious ASZ regions, which led to the precipitation of unique microconstituents such as nickel-rich and chromium-rich borides, as well as γ' solid solution phases in the bond region. Moreover, the highest shear strength (approximately 670 MPa) was observed in the sample bonded at 1150°C for 85 minutes. Interestingly, although incomplete solidification during bonding yielded the highest microhardness in the bond region, it was associated with the reduced shear strength performance.

کلیدواژه‌ها English

CMSX-4
Transient Liquid Phase Bonding
Bonding Temperature
Microstructure
Shear Strength
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مواد و فناوری‌های پیشرفته
دوره 14، شماره 2
تابستان 1404
صفحه 37-54

  • تاریخ دریافت 20 اردیبهشت 1404
  • تاریخ بازنگری 17 تیر 1404
  • تاریخ پذیرش 31 شهریور 1404