Journal of Advanced Materials and Technologies

Journal of Advanced Materials and Technologies

The effect of substrate preparation and the peak current density in pulse platingof Cu-SiCnanocompositecoatingsonmorphology, grain size, porosity, hardness and corrosion properties

Authors
S.M. Mirsaeedghazi
S.R. Allahkaram
School of Metallurgy and Materials Engineering, University College of Engineering, University of Tehran
10.30501/jamt.2635.70260
Abstract
Copper is widely used in different industries due to its good thermal and electrical conductivity.However, it can be in contact with fluid environments in these applications and thus, its corrosion properties are also important. In this study, copper/silicon carbide nano-composite coatings were deposited on copper substrates from sulfate bath by pulsed current and different current densities. The effects of copper surface preparation and current density on grain size, morphology,hardness, porosity, and corrosion properties of the coatings were investigated. Results revealed that, surface preparation before electrodeposition leaded to more uniform and less defective coatings. Grain size and porosity percent were decreased by increasing of current density. However, incorporation of nano-particles was also decreased by increasing of current density. Therefore, the optimum peak current density was achieved at 12A.dm-2at whichthe highest micro-hardness and thelowestcorrosion rateof the coatingsrespectively193 Hv and 0.008mA/cm2 obtained
Keywords
copper
silicon carbide
porosity
surface preparation
corrosion
composite
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Journal of Advanced Materials and Technologies
Volume 3, Issue 2
Summer 2014
Pages 27-35

  • Receive Date 05 May 2014
  • Revise Date 11 June 2014
  • Accept Date 15 June 2014