Journal of Advanced Materials and Technologies

Journal of Advanced Materials and Technologies

The Effect of Different Temperatures and Holding Times on Microstructural and Mechanical Characterization in the Two-Stage TLP Bonding of CMSX-4 Superalloy

Document Type : Original Reaearch Article

Authors
Arash Faraji 1
Mohammad Reza Rahimipour 2
Mohammad Farvizi 3
Hamid Omidvar 4
1 PhD Student, Department of Ceramic, Materials and Energy Research Center, Karaj, Iran.
2 Professor, Department of Ceramic, Materials and Energy Research Center, Karaj, Iran.
3 Associate Professor, Department of Materials Engineering, Faculty of Mechanical Engineering, University of Tabriz, P. O. Box: 51666-16471, Tabriz, , Iran.
4 Associate Professor, Department of Mining and Metallurgical Engineering, Amir Kabir University of Technology (Tehran Polytechnic), P. O. Box: 15875-4413,Tehran, Iran.
10.30501/jamt.2025.521355.1328
Abstract
Transient liquid phase (TLP) bonding is a critical process for joining materials such as CMSX-4, where precise control of variables is essential for achieving optimal results. This study investigates the effect of temperature and holding time in a two-step TLP process on the microstructural and mechanical behavior of CMSX-4 superalloy. In this work, CMSX-4 was joined using MBF 20 filler metal at temperatures of 1100°C and 1150°C for varying durations. The microstructure and mechanical properties of the bonded joints were characterized by X-Ray Diffraction (XRD), electron microscopy, elemental spectroscopy (EDS/WDS), microhardness testing, and shear tests. The results showed that complete isothermal solidification was achieved in the samples bonded at 1150°C for 85 minutes and at 1100°C for 120 minutes. Microstructural examination revealed different zones in the joints, including the Athermal Solidification Zone (ASZ), Isothermal Solidification Zone (ISZ), and Diffusion-Affected Zone (DAZ). The strength increased upon increasing time and eliminating the deleterious ASZ regions, which led to the precipitation of unique microconstituents such as nickel-rich and chromium-rich borides, as well as γ' solid solution phases in the bond region. Moreover, the highest shear strength (approximately 670 MPa) was observed in the sample bonded at 1150°C for 85 minutes. Interestingly, although incomplete solidification during bonding yielded the highest microhardness in the bond region, it was associated with the reduced shear strength performance.
Keywords
CMSX-4
Transient Liquid Phase Bonding
Bonding Temperature
Microstructure
Shear Strength

Subjects

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Journal of Advanced Materials and Technologies
Volume 14, Issue 2
Summer 2025
Pages 37-54

  • Receive Date 10 May 2025
  • Revise Date 08 July 2025
  • Accept Date 22 September 2025